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Vivid markings are a testament to quality.
The paint jet printer "TP-2000S" is actively used in production sites around the world for marking quality assurance of steel products such as small-diameter oil well pipes, shaped steel, and thick plates, as well as for marking the types of processed materials and LP gas containers.
Independently developed motion control technology allows for a maximum of 1.44 million dots to be ejected! Large-scale pad printing is possible.
The "Jet Setter Series" is a device that applies solder and epoxy using high-speed jetting without the use of stencil masks. It is capable of solving various issues in the general printing process and can minimize solder consumption. Users can control the amount of solder for each pad individually. It allows for rapid production response without the need to manufacture stencils. 【Features】 ■ Unique motion control technology allows for up to 1.44 million dots of jetting ■ User-defined control of solder amount for each pad ■ Capable of controlling various dot sizes ■ Reduction of resources required to optimize stencil design ■ Rapid production response possible without manufacturing stencils *For more details, please refer to the PDF document or feel free to contact us.
No metal mask required. Non-contact high-speed solder application! Compatible with various liquids, including SMT adhesives.
The "MY700" is a solder printing device that does not use a metal mask. By connecting it to existing metal mask printing devices and using our product to print solder only in necessary areas, we aim to improve the efficiency of component mounting and enhance productivity. Since there is no need to create a metal mask for prototype applications, we enable the introduction of new products efficiently and quickly, while simultaneously achieving cost reduction. 【Features】 ■ Efficient production preparation: Start production by simply selecting the printing program ■ Selection of suitable production methods - Compatible with cavity substrates, applying solder to uneven areas - Compatible with inserted components, applying solder around and on top of holes, and supporting assembled substrates *For more details, please download the PDF or feel free to contact us.
